Method and apparatus for polishing a workpiece
US7004827B1 · kind B1 · utility
72Cited by
20References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2004 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Feb 12, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A carrier has openings for holding workpieces during polishing. Upper and lower polishing pads push against upper and lower surfaces of the workpieces, respectively. A ring is provided within the openings. This ring surrounds the workpieces, and prevents or reduces roll-off.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.