Film forming apparatus, film forming method and tray for substrate
US7005009B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 3, 2002 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Jun 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The object of the present invention is to provide an apparatus suitable for forming a thick film having a thickness on a surface of a substrate such as a glass substrate, a semiconductor wafer or the like. In the apparatus according to the present invention, a stock station for a substrate and a treatment station for a substrate are adjacent to each other, portions for coating, film-forming, cleaning and drying are provided in the treatment station, a tray having a concave portion for accommodating a substrate defined on the surface thereof is provided, and a transfer device circulates the tray around the portions for coating, film-forming, cleaning and drying.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.