Conductive inks for metalization in integrated polymer microsystems
US7005179B2 · kind B2 · utility
8Cited by
21References
7Claims
0Family size
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Key dates
| Filing date | Feb 20, 2003 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Apr 20, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system of metalization in an integrated polymer microsystem. A flexible polymer substrate is provided and conductive ink is applied to the substrate. In one embodiment the flexible polymer substrate is silicone. In another embodiment the flexible polymer substrate comprises poly(dimethylsiloxane).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.