Providing high precision resistance in an integrated circuit using a thin film resistor of controlled dimension
US7005361B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2004 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Jun 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/474
Abstract
In one embodiment, an integrated circuit includes a thin film resistor, which includes a resistor material that has been deposited on a substrate surface within a channel defined by opposing first and second portions of a stencil structure formed on the substrate surface, the resistor material having an initial width determined by a width of the channel. The stencil structure has been adapted to receive a planarizing material that protects against reduction of the initial width of the resistor material during subsequent process steps for removing the stencil structure. A head mask overlays an end portion of the thin film resistor and a dielectric overlays the head mask, the dielectric defining a via formed in the dielectric above a portion of the head mask. A conductive material has been deposited in the via, coupled to the portion of the head mask and electrically connecting the thin film resistor to other components of the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.