RF passive circuit and RF amplifier with via-holes
US7005721B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 9, 2003 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Dec 9, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/957
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An input matching parallel inductor 114 which utilizes a spiral inductor, and an input matching parallel capacitor 115 which utilizes an MIM capacitor, both being constituting elements of an input matching circuit portion 125, form an input matching parallel capacitor 115 inside an input matching circuit via-hole 121 being formed by applying a method of surface via-hole to the front surface of a GaAs substrate 124. A choke inductor 119 which utilizes a spiral inductor, and a bypass capacitor 120 which utilizes an MIM capacitor, both being constituting elements of a drain voltage feeding circuit 107, form a bypass capacitor 120 inside a drain voltage feeding circuit via-hole 123 formed by applying a method of surface via-hole to the front surface of the GaAs substrate 124. A drain voltage terminal 136 is extended by a drawing wire 135 from between the spiral inductor and the drain voltage feeding circuit via-hole 123.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.