Discrete component comprising HF diodes in series with a common cathode
US7005725B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 23, 2003 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Apr 12, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/548
Abstract
An electric component comprising an assembly of two PIN diodes in series formed in a semiconductor substrate layer separated from a support layer by an insulating layer, the doped areas forming the electrodes of each diode having a depth equal to that of the substrate layer, the component including a first area of a first doping type surrounded with a second intrinsic area, itself surrounded with a third area of a second doping type, the third area being surrounded with a fourth area of the first doping type, the fourth area being surrounded with a fifth intrinsic area, itself surrounded with a sixth area of the second doping type, the third and fourth areas being covered and connected by a metal area, each of the first and sixth areas being connected to a contact pad on which rests a welding ball.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.