Method for machining glass substrate
US7007512B2 · kind B2 · utility
46Cited by
8References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 13, 2001 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Dec 4, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In the present invention, a surface 7 of a glass substrate 1 is irradiated with a laser beam 2 to thereby form a V-shaped groove 6. At that time, the laser beam 2 is condensed outside and above the glass substrate 1. The distance between a beam-condensing point 4 of the laser beam 2 and the surface 7 of the glass substrate 1 is changed to thereby make it possible to change the angle between opposite side surfaces of the V-shaped groove. The angle is in a range of from 30 degrees to 120 degrees. Further, the laser beam used in the present invention is pulsed light, preferably with a pulse width not larger than 10 picoseconds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.