Housing-less plate heat exchanger

US7007749B2 · kind B2 · utility

Assignee

• Modine Manufacturing Company · US

Inventors

• Viktor Brost · Neckartenzlingen, DE
• Rainer Kasinger · Haiterbach, DE

Key dates

• Filing date: Oct 24, 2002
• Grant date: Mar 7, 2006
• Expiry date: Nov 7, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S165/916
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

A housing-less plate heat exchanger is provided for transferring heat between at least a first fluid and a second fluid. The heat exchanger includes a plurality of heat exchange plates stacked to enclose flow channels for the first and second fluids between the plates, a first intermediate plate pair sandwiched between a first and second stack of the heat exchange plates, and a barrier located between the plates of the intermediate plate pair to separate the first fluid from the second fluid. The intermediate plate pair includes a first fluid port extending laterally from the heat exchanger to transfer the first fluid between the heat exchanger and a device other than the heat exchanger. The intermediate plates are joined to enclose a first chamber, with the first chamber opening to the first fluid port and to a manifold for the first fluid to direct the first fluid between the first fluid port and the manifold.