Solder bonding technique for assembling a tilted chip or substrate
US7007835B2 · kind B2 · utility
5Cited by
10References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2004 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Feb 10, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. The shape of the pads and the location of the solder bumps on the pads causes the surface tension of the solder to tilt the chip by pulling it to one side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.