High frequency emmitter and detector packaging scheme for 10GB/S transceiver
US7008120B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2003 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Mar 10, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/423
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus and packaging scheme that ensures that alignments between signal sending and detecting components in transceivers are optimized and maintained over the lifetime of the apparatus. This is accomplished through use of a pair of polymer optical modules, which are used to couple light sent to and received from respective fiber optic cables. During a pre-alignment process, head portions of the polymer optical modules are inserted into respective slots defined in a standoff that is mounted on an optical sub-assembly to which an emitter and detector are mounted, whereby these slots are configured so that the head portions slide along the sidewalls of the slots during assembly. During a subsequent active alignment process, each polymer optical module is positioned relative to its respective emitter or detector until a maximum signal is detected, whereupon the position of the components is quick-set using a UV-sensitive adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.