Communications adapter module
US7008122B2 · kind B2 · utility
1Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2003 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Jan 26, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4292
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An optical communications adapter module is provided which includes a XENPAK-sized casing and an XFP board assembly having an optical transmission connector and an optical reception connector where the XFP board assembly is positioned within the casing so the optical transmission connector and the optical reception connector are positioned in connector openings at a first end of the casing. The module further includes a conversion board that is coupled to the XFP board where the conversion board is capable of communicating data between the XFP board assembly and a client computing device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.