Advanced wafer refining
US7008300B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2002 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Jul 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A refining apparatus having magnetically responsive refining elements that can be smaller than the workpiece being refined are disclosed. The refining apparatus can supply a parallel refining motion to the refining element(s) through magnetic coupling forces. The refining apparatus can supply multiple different parallel refining motions to multiple different refining elements solely through magnetic coupling forces to improve refining quality and versatility. New refining methods, refining apparatus, and refining elements disclosed. Methods of refining using frictional refining, chemical refining, tribochemical refining, and electrochemical refining and combinations thereof are disclosed. A refining chamber can be used. New methods of control are refining disclosed. The new magnetic refining methods, apparatus, and magnetically responsive refining elements can help improve yield and lower the cost of manufacture for refining of workpieces having extremely close tolerances such as semiconductors wafers. Refining fluids are preferred. Reactive refining aids are preferred. Electro-refining for adding and removing material is disclosed. A method to use business calculations combined wi…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.