Patent · US Expired

Stabilized thermoplastic moulding materials

US7008986B2 · kind B2 · utility

5Cited by
13References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 22, 2001
Grant dateMar 7, 2006
Priority date
Expiry dateNov 4, 2021

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L101/00
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The invention relates to thermoplastic moulding materials containing A) 29 to (100 wt. % minus 1 ppb) of at least one thermoplastic polymer. B) 1 ppb to 1 wt. % or at least one polyethyleneimine homopolymer of copolymer, as well as C) 0 to 70 wt. % of other additives, as the essential constituents thereof. The weight percent of constituents A) to C) amounts to 100% in every case.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.