Stabilized thermoplastic moulding materials
US7008986B2 · kind B2 · utility
5Cited by
13References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2001 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Nov 4, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L101/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to thermoplastic moulding materials containing A) 29 to (100 wt. % minus 1 ppb) of at least one thermoplastic polymer. B) 1 ppb to 1 wt. % or at least one polyethyleneimine homopolymer of copolymer, as well as C) 0 to 70 wt. % of other additives, as the essential constituents thereof. The weight percent of constituents A) to C) amounts to 100% in every case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.