Wiring substrate, method of producing the same, and electronic device using the same
US7009114B2 · kind B2 · utility
3Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2001 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Dec 23, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.