Laser processing method, laser welding method, and laser processing apparatus
US7009138B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2004 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Apr 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A processing method including steps for splitting a single beam into a plurality of beams including a zero-order diffracted beam, by diffracting the single beam by a diffractive element, for turning an array of focused beam spots obtained from the plurality of beams about the center of the zero-order diffracted beam according to the direction of an array of welding points where parts mounted on a circuit board are welded to the board, for causing a spot interval between focused beam spots in the array to agree with the interval between the plurality of welding points by adjusting the distance from the diffractive element to the board, and for increasing the intensity of the plurality of beams, to a welding intensity, and connecting the parts by simultaneously irradiating the welding points with the focused beam spots in the array having the determined direction and spot interval.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.