Semiconductor device with a cavity therein and a method of manufacturing the same
US7009273B2 · kind B2 · utility
70Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2003 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Sep 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/213
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor substrate, cavities, and an element isolating region. The cavities, which are each shaped like a flat plate, are made in the semiconductor substrate. The element isolating region is formed in the surface of the semiconductor substrate and located at the sides of the cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.