Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method
US7009290B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2002 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Feb 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink for semiconductor components or similar devices, especially produced from an extruded aluminum alloy. The heat sink comprises cooling ribs which rise at a distance from a base plate and which are clamped in an insert groove made in the surface of the base plate, laterally limited by longitudinal or intermediate ribs with a coupling base that has an approximately rectangular cross-section. The coupling bases are held in their insert grooves in a form-fit and are cold-welded with the base plate at least in some sections. Cross ribs extend at a distance to one another on the surfaces of the intermediate ribs and have the form of upset heels that are linked with the coupling base in a form-fit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.