Methods and apparatus for improving high frequency input/output performance
US7009308B1 · kind B1 · utility
8Cited by
16References
8Claims
0Family size
Inventors
Key dates
| Filing date | Jan 13, 2005 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Jan 13, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit that eliminates an off-chip inductive component connected between an integrated circuit (IC) arranged on a package and an external load comprises a package and an IC that is arranged on the package. A first bondwire arranged on the package has one end that communicates with the external load and an opposite end that communicates with the IC. A second bondwire located on the package has one end that communicates with the external load and an opposite end that communicates with the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.