System and method for testing ball grid arrays
US7009413B1 · kind B1 · utility
61Cited by
4References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 10, 2003 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Oct 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for testing ball grid arrays (“BGAs”) is provided. The apparatus includes, a socket slot in a printed circuit board for holding a socket used for testing the BGAs; and plural holding members that support BGA solder balls. The socket top may have plural prong like holding members; plural circular holding members; and/or plural spiral holding members for supporting the solder balls. The holding members may be etched on a BGA socket top and are flexible, rigid and/or semi-rigid to provide support for the solder balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.