Tool with a sensor chip
US7010898B2 · kind B2 · utility
5Cited by
16References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 19, 2002 |
| Grant date | Mar 14, 2006 |
| Priority date | — |
| Expiry date | Jun 19, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65B59/02
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
The invention relates to a tool, especially in a packaging machine, for closing cavities in packaging and/or sealing and cutting packaging. The tool is raised and lowered by a lifting device. The invention also relates to a packaging machine comprising the tool and to a method for automatically adjusting the parameters of a packaging machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.