Swaging machine and method of use
US7010953B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2003 |
| Grant date | Mar 14, 2006 |
| Priority date | — |
| Expiry date | Jan 23, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53996
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A swaging machine is configured to substantially uniformly reduce the diameter of a tubular attachment, such as a marker band, to result in a smooth and repeatable finished part. The swaging machine comprises a feed system, an impact system, and a rotation system. A split die having a compound die cavity is provided for use in conjunction with the swaging machine to receive an impact force from the impact system and, in turn, apply a swaging force to the marker band. The rotation system rotates the impact system, including the die, about the axis of the marker band to apply swaging forces about the circumference of the marker band, while the feed system feeds the marker band through the die thereby applying swaging forces along the length of the marker band.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.