Method and apparatus for cooling electronic components
US7011143B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2004 |
| Grant date | Mar 14, 2006 |
| Priority date | — |
| Expiry date | Jun 17, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular fluid unit for cooling heat sources located on a rack, the modular fluid unit comprising: a heat exchanger in fluid communication a pump; and wherein the modular fluid unit is mountable within the rack and is configurable to be in fluid communication with a cold plate return manifold, a cold plate supply manifold, and an end-user fluid supply. A method for cooling electronic components in a rack, the method comprising: circulating a first liquid from a cold plate to one of a plurality of heat exchangers mounted within the rack; circulating a second liquid from a second liquid supply to the one of a plurality of heat exchangers; and transferring heat from the first liquid to the second liquid at the one of a plurality of heat exchangers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.