Patent · US Expired

Adhesive microstructure and method of forming same

US7011723B2 · kind B2 · utility

68Cited by
10References
5Claims
0Family size

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Key dates

Filing dateJan 6, 2003
Grant dateMar 14, 2006
Priority date
Expiry dateJan 30, 2024

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/298
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.