Adhesive microstructure and method of forming same
US7011723B2 · kind B2 · utility
68Cited by
10References
5Claims
0Family size
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Key dates
| Filing date | Jan 6, 2003 |
| Grant date | Mar 14, 2006 |
| Priority date | — |
| Expiry date | Jan 30, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/298
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.