Patent · US Expired

Reconfigurable modular microfluidic system and method of fabrication

US7011793B2 · kind B2 · utility

10Cited by
23References
31Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 23, 2004
Grant dateMar 14, 2006
Priority date—
Expiry dateMar 23, 2024

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T436/118339
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A reconfigurable modular microfluidic system, providing a microfluidic breadboard platform for the formation of fluidic network and fluidic sealing upon a system assembly. Modular microfluidic elements or “chips” are arranged on a precisely machined alignment base to form a fluidic network, with fluid connections provided directly from chip-to-chip at overlapping corners. Fluidic access to external devices is possible at every fluid connection and through special ingress/egress chips. By maintaining a largely planar layout, optical access is provided for detecting or visualization for every chip. The assembly may be covered by a perforated cover plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.