Method for producing encapsulated chips

US7011989B2 · kind B2 · utility

Assignee

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Karl-Friedrich Becker · Berlin, DE
• Tanja Braun · Berlin, DE
• Mathias Koch · Berlin, DE
• Andreas Ostmann · Berlin, DE
• Lars Böttcher · Schwarzenberg, DE
• Erik Jung · Falkensee, DE

Key dates

• Filing date: Oct 30, 2003
• Grant date: Mar 14, 2006
• Expiry date: Dec 9, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19104
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for producing encapsulated chips includes preparing a wafer with contacts projecting from a surface of the wafer. The wafer is disposed on a dicing substrate and diced into a plurality of spaced chips on the dicing substrate. The contacts are covered with a protection arrangement, then injection molding being conducted to introduce encapsulation material into the contacts and the trenches. Then the protection arrangement is removed so that the contacts are exposed.