Thermoplastic resin composition for electrical/electronic contact part and electrical/electronic contact part using the same
US7012112B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 4, 2003 |
| Grant date | Mar 14, 2006 |
| Priority date | — |
| Expiry date | Jan 10, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31797
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition for an electrical/electronic contact part according to the present invention includes a thermoplastic resin and a polyol, wherein the polyol is contained in a range of 0.2 to 10 parts by weight based on 100 parts by weight of the thermoplastic resin. Alternatively, a thermoplastic resin composition for an electrical/electronic contact part according to the present invention includes: a thermoplastic resin; a halogenated aromatic compound which is contained in a range of 1 to 50 parts by weight based on 100 parts by weight of the thermoplastic resin; and a double salt represented by at least one of (X2O)n.Sb2O5 and (YO)n.Sb2O5, where X represents a monovalent alkaline metal element, and Y represents a divalent alkaline earth metal element, and n represents a ratio of X2O or YO to Sb2O5 exceeding 0.7, the double salt having an adsorbed water elimination rate of not more than 50 min. as calculated in terms of titration time; or a polyol; wherein the double salt is contained in a range of 0.5 to 40 parts by weight based on 100 parts by weight of the thermoplastic resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.