Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
US7012120B2 · kind B2 · utility
9Cited by
22References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2001 |
| Grant date | Mar 14, 2006 |
| Priority date | — |
| Expiry date | Mar 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01077
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.