Light emitting diode device and manufacturing method
US7012281B2 · kind B2 · utility
23Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2003 |
| Grant date | Mar 14, 2006 |
| Priority date | — |
| Expiry date | Oct 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/833
Abstract
A light emitting diode device and method of manufacturing comprises a light-transmission conductive layer and a patterned transparent conductive layer. In accordance with the present invention, the light-transmission conductive layer and the patterned transparent conductive layer is spread optimal area above the LED device so as to enhance the transparency and ohmic property of LED device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.