Method and apparatus for intra-layer transitions and connector launch in multilayer circuit boards
US7013452B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2003 |
| Grant date | Mar 14, 2006 |
| Priority date | — |
| Expiry date | Mar 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0979
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus is disclosed that substantially reduces or eliminates the resonance that occurs in vias that connect the layers of a printed circuit board by electrically coupling a first transmission line in a circuit board to a second transmission line in a circuit board by two electrical paths having substantially the same electrical length. The two electrical paths are created by connecting the first transmission line to a first via which is in turn connected to a second via having a second transmission line with a plurality of connecting electrical paths between the two vias. In one illustrative embodiment, electrical traces are used to connect the top of the first via to the top of the second via and the bottom of the first via to the bottom of the second via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.