High temperature heat exchanger structure
US7013964B2 · kind B2 · utility
5Cited by
13References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2002 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Jan 17, 2023 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2013/006
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
To provide a thermal connection that can withstand mechanical stress in a high temperature structure comprising a panel having one face carrying a circuit made up of tubes in which a fluid flows, the outside walls of the tubes are covered in respective high thermal conductivity textile layers. The structure further comprises holding means for holding the tubes pressed in non-rigid manner against the panel. The structure enables heat exchange to take place between the panel and the fluid in order to cool the panel, to heat the fluid, or indeed in order to do both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.