Method and apparatus for inline measurement of material removal during a polishing or grinding process
US7014531B2 · kind B2 · utility
10Cited by
12References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 24, 2004 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Mar 24, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus for inline measurement of material removal during a polishing or grinding process including:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.