Process for degassing an aqueous plating solution
US7014679B2 · kind B2 · utility
16Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2002 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Jan 31, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A process for removing oxygen from a copper plating solution is provided. The solution is passed through a degasser comprising a shell and hollow hydrophobic fiber porous membranes wherein the shell while a vacuum is drawn on the surfaces of the fibers opposite the fiber surfaces contacted by the solution. Gas passed through the fiber walls while liquid is prevented from infiltrating the fiber pores. The composition of the solution is monitored so that the composition can be retained substantially constant by adding components of the solution as needed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.