Multilayer ceramic electronic component manufacturing method including a sintered adhesive layer with a resin and inorganic powder
US7014725B2 · kind B2 · utility
4Cited by
3References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 22, 2002 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Apr 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A first step of alternately stacking a ceramic sheet and an internal electrode with an adhesive layer between the ceramic sheet and the internal electrode to obtain a laminated body, and a second step of sintering the laminated body are provided. The adhesive layer includes a thermoplastic resin and at least one of Cr, Mg, Al, Si, a Cr compound, an Mg compound, an Al compound, an Si compound and an inorganic powder included in the ceramic sheet. This manufacturing method improves adhesion between a ceramic layer and the internal electrode after sintering and suppresses a structural defect such as delamination or a crack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.