Packaging container for electronic part
US7014896B1 · kind B1 · utility
5Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2000 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Nov 27, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31507
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An electronic component packaging container which comprises a multilayer polyester sheet having a base layer comprising a polyethylene terephthalate type resin and a polycarbonate type resin and a surface layer comprising a polycarbonate type resin, formed on at least one side of the base layer, wherein the base layer contains from 70 to 97 wt % of the polyethylene terephthalate type resin and from 3 to 30 wt % of the polycarbonate type resin based on the total amount of the polyethylene terephthalate type resin and the polycarbonate type resin, and the thickness of the surface layer is from 10 to 30% of the total thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.