Organometallic precursor mixture for forming metal alloy pattern and method of forming metal alloy pattern using the same
US7014979B2 · kind B2 · utility
5Cited by
6References
12Claims
0Family size
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Key dates
| Filing date | May 19, 2003 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | May 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/105
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An organometallic precursor mixture for forming a metal alloy pattern and a method of forming the metal alloy pattern using the same, wherein the metal alloy pattern having improved adhesive force to a substrate, heat resistance, and resistance to atmospheric corrosion can be readily formed using the organometallic precursor mixture by and exposing step without using a separate photosensitive resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.