Cloverleaf microgyroscope with through-wafer interconnects and method of manufacturing a cloverleaf microgyroscope with through-wafer interconnects
US7015060B1 · kind B1 · utility
28Cited by
18References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2004 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Dec 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a method of manufacturing a cloverleaf microgyroscope containing an integrated post comprising: attaching a post wafer to a resonator wafer, forming a bottom post from the post wafer being attached to the resonator wafer, preparing a base wafer with through-wafer interconnects, attaching the resonator wafer to the base wafer, wherein the bottom post fits into a post hole in the base wafer, forming a top post from the resonator wafer, wherein the bottom and top post are formed symmetrically around the same axis, and attaching a cap wafer on top of the base wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.