Method of forming heat spreader with down set leg attachment feature
US7015073B2 · kind B2 · utility
14Cited by
9References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2004 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Mar 22, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Numerous embodiments of a heat spreader, comprised of a plurality of downset legs, which provides a simple and lower cost method of forming a heat spreader as compared to conventional methods are disclosed, as well as novel apparatus and methods for attaching the heat spreader to a substrate and a secondary device to the heat spreader, are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.