Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the same
US7015256B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2002 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Mar 20, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/033
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive composition for forming a dielectric of the present invention comprising inorganic particles, an alkali developable resin and additives, wherein the additives comprise a compound having a quinonediazido group (C1), a compound containing at least two alkyletherified amino groups in the molecule (C2) and a thermal acid generator (C3), or wherein the inorganic particles comprise inorganic superfine particles (A-I) having a mean particle diameter of less than 0.05 μm and inorganic fine particles (A-II) having a mean particle diameter of not less than 0.05 μm.The composition can be calcined at low temperatures to form a dielectric layer with high dimensional precision, said layer having a high dielectric constant and a low dielectric loss. Also provided are a dielectric and an electronic part prepared from the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.