High force metal plated spring structure
US7015584B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2003 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Jul 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F17/0006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.