Additional contacting for an electrical component and piezoelectric component in the form of a multilayer structure

US7015629B2 · kind B2 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Karl Lubitz · Ottobrunn, DE
• Carsten Schuh · Baldham, DE
• Thorsten Steinkopff · Eglharting, DE
• Andreas Wolff · Munich, DE

Key dates

• Filing date: Oct 29, 2003
• Grant date: Mar 21, 2006
• Expiry date: Oct 29, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N30/50

Abstract

An additional contacting (30) for a piezoelectric component (10) is formed as a multilayer structure, wherein the piezoelectric component (10) is formed by a stack (16) of alternatingly arranged piezoelectric ceramic layers (11) and electrode layers (12, 13). The additional contacting (30) has a series of connecting elements (31) for connecting a metallization (15) of the electric component (10) to an electrical connecting element (19). In order to minimize mechanical loads during dynamic operation of the piezoelectric component (10), the additional contacting (30) is configured as an individual, structured component (32), especially in the form of a structured foil. Said structured foil (32) advantageously has a current conduction path (33) which is common to the connecting elements (31) and a contacting zone formed in the area of static base plate (17), wherein the additional contacting (30) is connected to the electrical connecting element in the area of said contacting zone.