Method for making multi-layer ceramic acoustic transducer
US7017245B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2003 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | May 4, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49007
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for manufacturing a multi-layer acoustic transducer with reduced total electrical impedance. The method is based on the bonding of two piezoelectric ceramic layers with confronting metallized surfaces to a thin electrical conductor, then electrically connecting the top and bottom surfaces to form a wrap-around electrode while a center conductor forms a second electrode. The total electrical impedance of a two-layer ceramic stack comprised of piezoelectric layers connected in this manner is one-fourth that of a solid ceramic element of the same size. This provides for better matching of the acoustic stack impedance to that of the electrical cable, increased penetration depth for imaging within the body, and improved acoustic element sensitivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.