Wall structure
US7017333B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 28, 2003 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | May 28, 2023 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2300/5024
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A wall structure (2) configured to be exposed to a thermal load. The wall structure having at least two layers including a first layer (5) and a second layer (6). The second layer (6) is located closer to a source of the thermal load than the first layer (5), and the layers (5, 6) are arranged so that heat is allowed to be conducted from the second layer (6) to the first layer (5). Each of the first and second layers (5, 6) are adapted to carry a significant portion of a structural load, and the second layer (6) exhibits a higher thermal conductivity and/or a lower thermal expansion than the first layer (5). The invention reduces the thermal strain in the wall structure (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.