Bond testing system, method, and apparatus
US7017422B2 · kind B2 · utility
21Cited by
21References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2004 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Apr 2, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/267
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A bond strength tester and method for determining certain bond strength parameters of a bonded component, including a phaselocker, a transducer, a loading device that is capable of applying stress-loads to the bond, a controller for controlling the loading device, a data recording device to acquire data, and a computer device to analyze data calculating certain bond strength parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.