Circuit for sensing on-die temperature at multiple locations
US7018095B2 · kind B2 · utility
3Cited by
19References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2002 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Jun 27, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/01
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A circuit for sensing on-die temperature at multiple locations using a minimum number of pins is described. Thermal diodes coupled to pins are placed on a die to measure the temperature at various die locations. Voltage is applied to the pins to determine the temperature at each given diode location. The polarity of the voltage applied across the pins determines what diodes are selected for measurement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.