Powder supplying apparatus and powder molding apparatus
US7018194B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2001 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | May 27, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB30B15/0017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A powder molding apparatus comprises a mold comprising a die having a powder molding space and upper and lower punch units, and a compression driving mechanism for performing compression molding by driving the upper and lower punch units independently, wherein molded articles formed by the compression molding are held by engaging lower first and second punches serving as a formed article holding mechanism at the time of transporting the molded articles. Thus, the molded articles can be prevented from falling or shifting while being transported between stages, thereby providing a powder molding apparatus capable of high speeds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.