Adhesive film for underfill and semiconductor device using the same
US7018718B2 · kind B2 · utility
0Cited by
7References
4Claims
0Family size
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Key dates
| Filing date | Mar 25, 2004 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Mar 25, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive film for underfill excellent in relaxation effect of the stress generated in the above semiconductor element and the wiring circuit board and in the connecting electrode parts and also excellent in reliability of electrical connection between the semiconductor element and the wiring circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.