Low application temperature hot melt adhesive
US7019060B1 · kind B1 · utility
5Cited by
41References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1999 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Nov 12, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L91/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from about 5 to about 60 weight percent ethylene vinyl acetate with about 30 to about 50 weight percent VA content and having a melt index of about 700 to about 4,000 dg/min; a tackifier; and wax with a melting point of about 125 to about 180° F.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.