Terminal, semiconductor device, terminal forming method and flip chip semiconductor device manufacturing method
US7019405B2 · kind B2 · utility
5Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2003 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | May 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a terminal, a semiconductor device, a terminal forming method and a flip chip semiconductor device manufacturing method, it is possible to lessen damage to a semiconductor element due to vibration caused by an ultrasonic wave and settle misalignment and height unevenness of terminals. The terminal includes a pad provided on an active surface of an electric element having an IC chip, a metal post connected to the pad, and a projection electrode provided on the metal post.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.