Thermal management systems for micro-components
US7019971B2 · kind B2 · utility
33Cited by
11References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 30, 2003 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | May 27, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods for providing self-contained, closed-loop microchannel cooling systems that can be integrated into a micro-component package, such as a microelectronic package, are described herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.