Method of attaching non-adhesive thermal interface materials
US7019977B2 · kind B2 · utility
7Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2003 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Dec 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Securing a heat sink to an electronic device, such as an integrated circuit package, includes applying an adhesive layer to only a periphery of a surface on a thermal interface material. The thermal interface material is applied to the heat sink and/or integrated circuit package using the adhesive layer. The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.